LMT035DNJFWD-NAN
LCD Module User Manual
Prepared by:
Checked by:
Approved by:
Caiwei
Date: 2022-07-06
Date:
Date:
Rev.
Descriptions
Release Date
0.1
Preliminary New release
2020-06-22
0.2
Update Electrical Characteristics
2020-07-16
0.3
Add interface mode selection
2022-07-06
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Table of Content
1. Basic Specifications.....................................................................................................................3
1.1 Block Diagram...................................................................................................................................................................3
1.2 Terminal Functions...........................................................................................................................................................4
2. Absolute Maximum Ratings.........................................................................................................5
3. Electrical Characteristics.............................................................................................................5
3.1 DC Characteristics............................................................................................................................................................5
4. AC Characteristics........................................................................................................................6
4.1 DBI Type B........................................................................................................................................................................6
4.2 3-Line SPI Interface Timing Characteristic.......................................................................................................................9
4.3 4-Line SPI Interface Timing Characteristic.....................................................................................................................10
4.5 Power ON/OFF Sequence..............................................................................................................................................11
4.6 Reset timing....................................................................................................................................................................13
5. Optical Characteristics...............................................................................................................13
6. LCD Module Design and Handling Precautions ....................................................................................... 16
7. CTP Mounting Instructions ................................................................................................................................ 17
8. RTP Mounting Instructions ................................................................................................................................ 18
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1. Basic Specifications
Screen Size(Diagonal) :
3.5”
Active Area :
48.96x73.44(mm)
Number of dots :
480x320(RGB)
Pixel Pitch :
0.153x0.153(mm)
Color Depth:
65K/262K Color
Display Technology :
a-Si TFT active matrix
Display Mode :
Transmissive With Normally white
Display Interface :
RGB
Viewing Direction :
3 o ’ clock (gray scale inverse)(*1)
9 o ’ clock (*2)
Touch Panel :
-
PolarizerSurface Treatment:
HC
Touch Interface:
-
Operating Temperature :
-20 ~ +70°C (No Condensation)
Storage Temperature :
-30 ~ +80°C (No Condensation)
Note:
*1. For saturated color display content (eg. pure-red, pure-green, pure-blue or pure-colors-combinations).
*2. For “color scales” display content.
*3. Color tone may slightly change by temperature and driving condition.
1.1 Block Diagram
BLEN
VSS
Backlight Circuit
480x 320(RGB) pixels
TFT Panel
VSS
VDD
D0(SDA),D1(SDO)~D7
TFT Driver
/WR(D/C),/RD,/CS,/RES,D/C(SCL)
ILI9488 or equivalent
FMARK
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1.2 Terminal Functions
Pin No.
Pin
Descriptions
(K1)
Name
I/O
80-8bit(default)
3-SPI
4-SPI
1
VSS
P
Negative power supply,0V
2
VSS
Backlight enable
3
BLEN
I
BLEN = H: turn off Backlight
BLEN = L: turn on Backlight
(*1)
4
VDD
P
Positive power supply
5
VDD
6
/RD
I
Read enable input, active low
Please fix this pin at VDD
Display
Please fix
data/command
7
/WR(D/C)
I
Write enable input, active low
this pin at
selection pin in
VDD.
4-line serial
interface.
Register Select
D/C=H, Transferring the Display
8
D/C(SCL)
I
Data
This pin is used to be serial
D/C = L, Transferring the Control
interface clock.
Data
Chip Select
9
/CS
I
/CS=L, enable access to the LCD module
/CS=H, disable access to the LCD module
The data is latched on the
10
D0(SDA)
I/O
rising edge of the SCL
signal.
SPI interface output pin.
11
D1(SDO)
I/O
Data Input
The data is output on the
rising edge of the SCL
signal.
:
:
:
17
D7
I/O
Please fix this pin at VDD or
GND level.
Reset signal
18
/RES
I
/RES = L, Initialization is executed
/RES = H, Normal running.
19
FMARK
O
Displaying Timing Frame Signal
20~28
NC
-
-
*1 :The PWM frequency is between 2k Hz and 10kHz.
*2 :System interface select
Mode
Install
No install
80-8bit (default)
R23,R24(0R,0603,5%)
R22,R25
3-SPI
R22,R25(0R,0603,5%)
R23,R24
4-SPI
R22,R24(0R,0603,5%)
R23,R25
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2. Absolute Maximum Ratings
VDD =5V, VSS=0V, T OP =25  C
Items
Symbol
Min.
Max.
Unit
Condition
Power Voltage
VDD
-0.3
+5.5
V
V SS = 0V
Input Voltage
V IN
-0.3
+5.5
V
V SS = 0V
Operating Temperature
T OP
-20
+70
C
No Condensation
Storage Temperature
T ST
-30
+80
C
No Condensation
Cautions:
Any Stresses exceeding the Absolute Maximum Ratings may cause substantial damage to the device. Functional
operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure
to extreme conditions may affect device reliability.
3. Electrical Characteristics
3.1 DC Characteristics
VDD =5V, IOVCC=3.3V,VSS=0V, T OP =25 C
Items
Symbol
MIN.
TYP.
MAX.
Unit
Condition /
Application Pin
Operating Voltage
VDD
4.8
5.0
5.2
V
VDD
Input High Voltage
V IH
0.7*IOVCC
-
IOVCC
V
/RES,D0(SDA),
D1(SDO)~D7
Input Low Voltage
V IL
-0.3
-
0.3*IOVCC
V
/CS,/RD,/WR,BLEN,
D/C(SCL)
Output High
Voltage
V OH
0.8*IOVCC
-
IOVCC
V
Output Low
D0~D7, SDO,FMARK
Voltage
V OL
0
-
0.2*IOVCC
V
Operating Current
I DD
-
105
-
mA
Backlight are ON
-
4.8
-
mA
Backlight are OFF
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4. AC Characteristics
4.1 DBI Type B
4.1.1 DBI Type B Timing Characteristic
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4.1.2 DBI Type B Data Bus
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4.2 3-Line SPI Interface Timing Characteristic
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4.3 4-Line SPI Interface Timing Characteristic
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4.5 Power ON/OFF Sequence
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IOVDD and VDD can be applied or powered down in any order. During the Power Off sequence ,if the LCD is
in the Sleep In mode, VDD and IOVDD must be powered down with a minimum of 120 msec.If the LCD is in
the Sleep In mode, VDD and IOVDD can be powered down with a minimum of 0msec after the /RST has
been released. /CS can be applied at any time or can be permanently grounded. /RST has priority over /CS.
Notes:
1.
There will be no damage to the ILI9488 if the power sequences are not met.
2.
There will be no abnormal visible effects on the display panel during the Power On/Off Sequence.
3.
There will be no abnormal visible effects on the display between the end of the Power On Sequence and before receiving the Sleep
Out command, and also between receiving the Sleep In command and the Power Off Sequence.
4.
If the /RST line is not steadily held by the host during the Power On Sequence as defined in Sections 11.1 and 11.2 ( ILI9488
datasheet ), then it will be necessary to apply the Hardware /RST after the completion of the Host Power On Sequence to ensure
correct operations. Otherwise, all the functions are not guaranteed.
5.
When the power is turned on, the climb period timing (Trise) must be greater than 10us.
6.
Keep data pins D[17:0] at low level, or IOVDD comes later
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4.6 Reset timing
Item
Symbol
MIN.
TYP.
MAX.
Unit
Reset LOW pulse width
t RW
1.0
-
-
us
Reset time
T RT
-
-
120
ms
5 . Optical Characteristics
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6. LCD Module Design and Handling Precautions
6. 液晶显示模块设计和使用须知
-
Please ensure V0, VCOM is adjustable, to enable LCD module -
请注意V0, VCOM 的设定, 以确保液晶显示模块在
get the best contrast ratio under different temperatures, view
不同的使用温度下以及在不同的视角和位置观察
angles and positions.
模块显示,均能达到最佳对比度,请务必将应用
电路上设置为对比度可调。
-
Normally display quality should be judged under the best -
请注意液晶显示模块的显示品质判定是指在正常
contrast ratio within viewable area. Unexpected display pattern
对比度下以及视窗(V.A)范围内进行的,非正常对
may com out under abnormal contrast ratio.
比度下液晶可能会出现非预期的显示不良,应注
-
Never operate the LCD module exceed the absolute maximum
意区分。
ratings.
-
请勿在最大额定值以外使用液晶显示模块。
-
Never apply signal to the LCD module without power supply.
-
请勿在没有接通电源的条件下,给液晶显示模块
-
Keep signal line as short as possible to reduce external noise
输送信号。
interference.
-
请尽可能缩短信号线的连接,以避免对液晶显示
-
IC chip (e.g. TAB or COG) is sensitive to light. Strong light might
模块的信号干扰。
cause
malfunction.
Light
sealing
structure
casing
is -
集成电路因IC芯片(如TAB或COG)对 外线极为
recommended.
敏感,强光环境下可能会引起液晶显示模块功能
失效,故应采用不透光的外壳。
-
Make sure there is enough space (with cushion) between case -
请在液晶显示模块与外壳之间保留足够的空间(可
and LCD panel, to prevent external force passed on to the panel;
使用衬垫),以缓冲外力对液晶显示模块的损坏或
otherwise that may cause damage to the LCD and degrade its
因受力不均而产生的显示不匀等异常现象。
display result.
-
Avoid showing a display pattern on screen for a long time -
避免液晶显示屏在某一画面下长时间点亮,否则
(continuous ON segment).
有出现残影的风险;请通过软件每隔一段时间改
变一次画面。
-
LCD module reliability may be reduced by temperature shock.
-
液晶显示模块的可靠性可能因温度冲击而降低。
-
When storing and operating LCD module, avoids exposure to -
请勿在阳光直射、高湿、高温或低温下储存和使
direct sunlight, high humidity, high or low temperature. They may
用液晶显示模块,这将造成液晶显示模块的损坏
damage or degrade the LCD module.
或失效。
-
Never leave LCD module in extreme condition (max./min
storage/operate temperature) for more than 48hr.
-
请勿在极限环境(最大/最小存储/工作温度)下使
-
Recommend LCD module storage conditions is 0 C~40 C
用或放置液晶显示模块超过48小时以上。
<80%RH.
-
液晶显示模块建议存储条件为: 0 C~40 C <80%RH
-
LCD module should be stored in the room without acid, alkali -
请勿让液晶显示模块存储于带有 酸性, 碱性, 有
and harmful gas.
害气体环境之中。
-
Avoid dropping & violent shocking during transportation, and no -
在运输过程中, 请勿让液晶显示模块跌落与猛烈
excessive pressure press, moisture and sunlight.
震动, 同时避免 异常挤压, 高湿度, 与阳光照
-
LCD module can be easily damaged by static electricity. Please
射.
maintain an optimum anti-static working environment to protect -
液晶显示模块极易受静电损坏,请务必保证液晶
the LCD module. (eg. ground the soldering irons properly)
显示模块在防静电的工作环境中使用或保存。
-
Be sure to ground the body when handling LCD module.
(如: 烙铁正确接地,等)
-
Only hold LCD module by its sides. Never hold LCD module by -
拿取液晶显示模块时需注意操作人员的接地情
applying force on the heat seal or TAB.
况。
-
When soldering, control the temperature and duration avoid -
请手持液晶显示模块的边沿取放模块,防 止热 压
damaging the backlight guide or diffuser which might degrade
纸 或TAB 部 位受力。
the display result such as uneven display.
-
焊 接液晶模块时,请注意 控制 烙铁的温度、 焊 接
-
Never let LCD module contact with corrosive liquids, which might
时间,以免 烫 坏 导 光 板 或 偏 光片, 导致 显示不匀
cause damage to the backlight guide or the electric circuit of
等不良现象 发 生。
LCD module.
-
请勿使用 洗板水 等 腐蚀 性液体接 触 液晶模块,以
-
Only clean LCD with a soft dry cloth, Isopropyl Alcohol or Ethyl
免 腐蚀导 光 板 或模块电路。
Alcohol. Other solvents (e.g. water) may damage the LCD.
-
Never add force to components of LCD module. It may cause -
仅 可使用 柔 软的干 布 , 异 丙醇 或 乙醇清洁 液晶屏
invisible damage or degrade the module's reliability.
表 面, 其他任何溶剂 (如: 水 ) 都 有可能损坏液晶模
-
When mounting LCD module, please make sure it is free from
块。
twisting, warping and bending.
-
请勿挤压液晶显示模块上的 元器 件,以避免产生
-
Do not add excessive force on surface of LCD, which may cause
潜 在的损坏或失效而影 响 产品可靠性。
the display color change abnormally.
-
装配 液晶显示模块时,请务必注意避免液晶显示
-
LCD panel is made with glass. Any mechanical shock (e.g.
模块的 扭曲 或变 形 。
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dropping from high place) will damage the LCD module.
-
请勿挤压液晶显示屏 表 面,这将 导致 显示 颜色 的
异常。
-
液晶屏 由玻璃制 作而成, 任何机械碰撞 (如 从 高 处
跌落)均有可能损坏液晶显示模块。
-
Protective film is attached on LCD screen. Be careful when -
液晶屏 表 面带有保 护膜 , 揭除 保 护膜 时需 要 注意
peeling off this protective film, since static electricity may be
可能产生的静电。
generated.
-
因液晶显示屏 表 面的 偏 光片极易 划伤 , 安装完 成
-
Polarizer on LCD gets scratched easily. If possible, do not
之 前 请尽 量 不 要揭 下保 护膜 。
remove LCD protective film until the last step of installation.
-
请缓 慢揭除 保 护膜 ,在 此 过程中液晶显示屏上可
-
When peeling off protective film from LCD, static charge may
能会产生静电线, 此 为正常情况,可在短时间内
cause abnormal display pattern. The symptom is normal, and it
消 失。
will turn back to normal in a short while.
-
LCD panel has sharp edges, please handle with care.
-
请注意避免 被 液晶显示屏的边 缘割伤 。
-
Never attempt to disassemble or rework LCD module.
-
请不 要试图拆卸 或改造液晶显示模块。
-
If display panel is damaged and liquid crystal substance leaks -
当 液晶显示屏出现 破裂 , 内 部 液晶液体可能 流 出 ;
out, be sure not to get any in your mouth, if the substance comes
相关 液体不可 吞吃 , 绝 对不可接 触嘴巴 , 如接 触
into contact with your skin or clothes promptly wash it off using
到 皮肤 或 衣服 , 请使用 肥皂 与 清水彻底清洗 .
soap and water.
7 . CTP Mounting Instructions
7. 容触摸 安装
7.1 Bezel Mounting (Figure 1)
7.1 框安装(附图1)
-
The bezel window should be bigger than the CTP active area. It -
客户 面 框 窗 口 应大于CT P 动作区 域 , 各 边 离 动作区
should be≥0.5mm each side.
应 ≥ 0. 5mm .
-
Gasket should be installed between the bezel and the CTP -
面 框 与CT P 面 板 间应垫有 胶 垫, 其 最 终 间 隙约 为
surface.
0. 5~1 .0 mm .
The final gap should be about 0.5~1.0mm.
-
建议必 要 时在 背 面 提供附加支架 ( 例 如 无安装结
-
It is recommended to provide an additional support bracket for
的 薄型 T F T模块),应 仅利 用 适当支撑 以保持模块
backside support when necessary (e.g. slim type TFT module
位置.
without
mounding
structure).
They
should
only
provide
appropriate support and keep the module in place.
-
The mounting structure should be strong enough to prevent -
安装结 应 具 有足够的强度,以防 止 外 部 不均匀
external uneven force or twist act onto the module.
力或 扭曲 力作用到模块上.
                                                                                                      Figure 1
7.2 Surface Mounting (Figure 2)
7.2 嵌入安装(附图2)
-
As the CTP assembling on the countersink area with double side -
客户 面 框 应 具 有使用 双 面 胶粘贴 CT P 的 结 沉台
adhesive.
面, 其粘贴 面 要求平整且洁净无污 以保证 粘贴牢
The countersink area should be flat and clean to ensure the
靠.
double side adhesive installation result.
-
The Bezel is recommend to keep a gap (≥0.3mm each side)
around the cover lens for tolerance.
-
考虑 到 制 作 误差 ,建议面 框 与CT P盖板 之间 四周 留
-
It is recommended to provide an additional support bracket with
有 ≥ 0. 3mm 间 隙 .
gasket for backside support when necessary (e.g. TFT module -
建议必 要 时在 背 面 提供 垫有 胶 垫 附加支架 ( 例 如 无
without
mounding
structure).
They
should
only
provide
安装结 的T F T模块),应 仅利 用 适当支撑 以保持
appropriate support and keep the module in place.
模块位置.
-
The mounting structure should be strong enough to prevent
external uneven force or twist act onto the module
-
安装结 应 具 有足够的强度,以防 止 外 部 不均匀
力或 扭曲 力作用到模块上。
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Figure 2
7.3 Additional Cover Lens Mounting (Figure 3)
7.3  覆加盖板(附图3)
-
For the case of additional cover Lens mounting, it is necessary -
需 要覆加玻璃盖板 的 安装 ,为确保 其 功能,有必
to recheck with the CTP specification about the material and
要查看 产品 规格书 中有 关盖板材料 和 厚 度的 说明 .
thickness to ensure the functionality.
-
It should keep a 0.2~0.3mm gap between the cover lens and the -
玻璃盖板 与CT P表 面之间应留有0. 2~ 0. 3mm 间 隙 .
CTP surface..
-
The cover lens window should be bigger than the active area of -
玻璃盖板 视窗应大于CT P 动作区 域 , 各 边 离 动作区
the CTP.It should be≥0.5mm each side.
应 ≥ 0. 5mm 。
-
It is recommended to provide an additional support bracket for -
建议必 要 时在 背 面 提供附加支架 ( 例 如 无安装结
backside support when necessary (e.g. slim type TFT module
的 薄型 T F T模块),应 仅利 用 适当支撑 以保持模块
without
mounding
structure).
They
should
only
provide
位置.
appropriate support and keep the module in place.
-
The mounting structure should be strong enough to prevent
external uneven force or twist act onto the module.
-
安装结 应 具 有足够的强度,以防 止 外 部 不均匀
力或 扭曲 力作用到模块上.
                                                                                                      Figure 3
8. RTP Mounting Instructions
8. 阻触摸 安装
-
It should bezel touching the RTP Active Area (A.A.) to prevent
-
为避免面 框 直接压在动作区(A.A.)上造成 误 动作,
abnormal touch.It should left gab D=0.2~0.3mm in between.
面 框 与电 阻触摸 屏( R T P )之间应留有一定的空 隙
(Figure 4)
D= 0. 2~ 0. 3mm 之间.( 附图 4)
-
Outer bezel design should take care about the area outside the -
设计面 框 时, 要 注意用面 框 保 护触摸 屏 四周 的非保
A.A. Those areas contain circuit wires which is having different
证操作区 域 ,因为 布 线区 域 在 此处形 成一 台阶 ,
thickness. Touching those areas could de-form the ITO film. As a
在 此 区 域附近 操作时ITO Film 变 形较 大, 容 易 导
result bezel the ITO film be damaged and shorten its lifetime.
致 ITO损坏而降低 寿命 。为保 护R T P 和避免 误 操
It is suggested to protect those areas with gasket (between the
作,在 R T P 与面 框 之间垫缓冲 物( G asket) , 我们
bezel and RTP).The suggested figures are B≥0.50mm;
建议设计面 框 应 覆盖 动作区的边 缘 ,面 框 边 缘 到
C≥0.50mm. (Figure 4)
V.A.区的 距离 B ≥ 0. 5 0 mm; 垫 圈 内边 缘 到V.A.区的
距离 C ≥ 0. 5 0 mm . ( 附图 4)
-
The bezel side wall should keep space E= 0.2 ~ 0.3mm from the -
在设计面 框 与 R T P组装 时,应 考虑 到面 框 内 侧 与
RTP. (Figure 4)
R T P 外 侧 的间 距E≥ 0. 2mm . ( 附图 4)
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Figure 4
-
In general design,
-
通常设计时:
RTP V.A. should be bigger than the TFT V.A.
R T P 的可视区 V.A. 应不小于T F T 的可视区 V.A.
and RTP A.A. should be bigger than the TFT A.A.
及 R T P 的动作区 A.A. 应不小于T F T 的动作区
(Figure 5)
A.A.
( 附图5 )
Figure 5
Warranty
This product has been manufactured to our company’s specifications as a part for use in your company’s general
electronic products. It is guaranteed to perform according to delivery specifications. For any other use apart from
general electronic equipment, we cannot take responsibility if the product is used in medical devices, nuclear power
control equipment, aerospace equipment, fire and security systems, or any other applications in which there is a direct
risk to human life and where extremely high levels of reliability are required. If the product is to be used in any of the
above applications, we will need to enter into a separate product liability agreement.
-
We cannot accept responsibility for any defect, which may arise form additional manufacturing of the product
(including disassembly and reassembly), after product delivery.
-
We cannot accept responsibility for any defect, which may arise after the application of strong external force to the
product.
-
We cannot accept responsibility for any defect, which may arise due to the application of static electricity after the
product has passed our company’s acceptance inspection procedures.
-
When the product is in CCFL models, CCFL service life and brightness will vary according to the performance of the
inverter used, leaks, etc. We cannot accept responsibility for product performance, reliability, or defect, which may
arise.
-
We cannot accept responsibility for intellectual property of a third part, which may arise through the application of
our product to our assembly with exception to those issues relating directly to the structure or method of
manufacturing of our product.
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