LMT070ENMFWA-NND-4
LCD Module User Manual
Prepared by:
Checked by:
Approved by:
Liyongzheng
WangGang
Date: 2025-04-08
Date: 2025-04-14
Date:
Rev. Descriptions
Edit
Release Date
0.1
Preliminary release
chenzhonghua 2023-05-05
0.2
Update Instructions
Liyongzheng
2025-04-08
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Table of Content
1. Applications....................................................................................................................................3
2. General Specification....................................................................................................................3
3. Block Diagram................................................................................................................................3
4. Terminal Function..........................................................................................................................4
4.1 K1 TFT Input Terminal....................................................................................................................................................4
4.2 K2 Capacitive Touch Panel Terminal............................................................................................................................. 5
5. Absolute Maximum Ratings......................................................................................................... 5
6. Electrical Characteristics..............................................................................................................5
6.1 TFT Characteristics....................................................................................................................................................... 5
6.2 CTP Characteristics........................................................................................................................................................5
6.3 LED Backlight Circuit Characteristics............................................................................................................................. 6
6.4 Power Sequence............................................................................................................................................................ 6
7. AC Characteristics.........................................................................................................................7
7.1 TFT Timing Characteristics.............................................................................................................................................7
7.2 TFT Input Clock and Data Timing Diagram.................................................................................................................... 7
7.3 TFT Timing..................................................................................................................................................................... 8
7.4 TFT Data Input Format................................................................................................................................................... 8
7.5 CTP I2C Timing............................................................................................................................................................. 9
7.6 CTP I2C Interface Data Structure...................................................................................................................................9
7.7 Optical Characteristics..................................................................................................................................................11
8. LCD Module Design and Handling Precautions.......................................................................12
9. CTP Mounting Instructions......................................................................................................... 13
9.1 Surface Mounting (Figure 1) .................................................................................................................................................. 13
9.2 Pressure sensitive adhesive tape operation .............................................................................................................................. 14
Warranty............................................................................................................................................15
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1. Applications
This Module is designed for portable DVD, GPS car TV & PMP(portable multimedia player)
application which require high quality flat panel displays. It is also a good substitute for many
outmoded CSTN module in the industrial application.
This product is composed of a TFT-LCD panel, driver ICs, FPC ,LED backlight unit .
2. General Specification
Signal Interface :
Digital 24-bits RGB
Display Technology :
a-Si TFT active matrix
Display Mode :
Normally Back
Screen Size(Diagonal) :
7.0”
Outline Dimension :
177.5x 109.5 x 8.575 (mm)
(see attached drawing for details)
Active Area :
154.21x 85.92(mm)
Number of dots :
1024x 3 (RGB) x 600
Pixel Pitch :
0.1506x 0.1432(mm)
Pixel Configuration :
RGB Stripe
Backlight :
White LED
Viewing Direction :
Full
Operating Temperature :
-20 ~ +70°C
Storage Temperature :
-30 ~ +80°C
Note:
*1. For saturated color display content (eg. pure-red, pure-green, pure-blue or pure-colors-combinations).
3. Block Diagram
D+,D-,VDD(5V),GND
CTP Controller
Capacitive Touch Panel
RST,INT,SDA,
SCL,VDD(3.3V),GND
VLED+,VLED-
Backlight LED
DVDD, GND, AVDD
VGH, VGL
DCLK
7’’ TFT Panel
DE, HS,
MODE
DITHB
R0~R7, G0~G7, B0~B7
Source Driver
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4. Terminal Function
4.1 K1 TFT Input Terminal
Pin No.
Pin Name
I/O
Descriptions
1
VLED+
2
VLED+
Power
Positive Backlight Power Supply
3
VLED-
4
VLED-
Power
Negative Backlight Power Supply
5
GND
Power
Power GND (0V)
6
VCOM
Input
Common voltage
7
DVDD
Power
Power for Digital Circuit
8
MODE
Input
DE/SYNC mode select (*1)
9
DE
Input
Data input enable
10
VS
Input
Vertical Sync Input
11
HS
Input
Horizontal Sync Input
12
B7
:
:
Input
8bit Data for Blue
19
B0
20
G7
:
:
Input
8bit Data for Green
27
G0
28
R7
:
:
Input
8bit Data for Red
35
R0
36
GND
Power
Power GND (0V)
37
DCLK
Input
Sample clock(*2)
38
GND
Power
Power GND (0V)
39
L/R
Input
Left / right selection (*3)
40
U/D
Input
Up/down selection (*3)
41
VGH
Power
Gate ON Voltage
42
VGL
Power
Gate OFF Voltage
43
AVDD
Power
Power for Analog Circuit
44
RESET
Input
Global reset pin (*4)
45
NC
-
No connection
46
VCOM
Input
Common Voltage
47
DITHB
Input
Dithering seting. L:6 bit resolution; H:8 bit resolution
48
GND
Power
Power GND (0V)
49
NC
-
50
NC
No connection
Note:
* 1: DE/SYNC mode select. Normally pull high.
When select DE mode, MODE=”1”, VS and HS must pull high.
When select SYNC mode, MODE= “0”, DE must be grounded.
* 2: Data shall be latched at the falling edge of DCLK.
* 3: Selection of scanning mode
Setting of scan control input
U/D
L/R
Scanning direction
GND
DVDD
Up to down, left to right
DVDD
GND
Down to up, right to left
GND
GND
Up to down, right to left
DVDD
DVDD
Down to up, left to right
*4: Global reset pin. Active low to enter reset state. Suggest to connect with an RC reset circuit for stability. Normally pull high.
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4.2 K2 Capacitive Touch Panel Terminal
Pin No Pin Name
I/O
Descriptions
1
RST
I/O
Touch Panel Reset
2
VDD3.3V
Power
I2C power supply(3.3V)
3
GND
Power
Ground(0V)
4
INT
I/O
Touch Panel INT
5
SDA
I/O
I2C DATA
6
SCL
I/O
I2C DCLK
7
GND
Power
Ground(0V)
8
D+
I/O
USB D+ signal
9
D-
I/O
USB D- signal
10
VDD(+5V)
Power
USB Power Supply(5V)
Note1: CTP Driver IC:ILI2511.
5. Absolute Maximum Ratings
Items
Symbol
Min.
Max.
Unit
Condition
Power voltage
DVDD
-0.5
5.0
V
input voltage
Vin
-0.5
5.0
V
Note1
Operating Temperature
TOP
-20
70
°C
No Condensation
Storage Temperature
TST
-30
80
°C
No Condensation
Note:
*1: Input voltageinclude R0~R5, G0~G5, B0~B5, Dotclk, Hsync, Vsync, Enable, R/L, U/D.(For your reference)
* 2: Ta means the ambient temperature.
It is necessary to limit the relative humidityto the specified temperature range.
Condensation on the module is not allowed.
6. Electrical Characteristics
6.1 TFT Characteristics
Items
Symbol
Min.
Typ.
Max.
Unit Remark
DVDD
3.0
3.3
3.6
V
*2
Power voltage
AVDD
10.8
11
11.2
V
VGH
19
20
21
V
VGL
-6.5
-6
-5.5
V
Input signal voltage
VCOM
4.3
4.4
4.5
V
Input logic high voltage
VIH
0.7DVDD
-
DVDD
V
Input logic low voltage
VIL
0
-
0.3DVDD
V
*3
Note:
*1.Be sure to apply DVDD and VGL to the LCD first, and then apply VGH.
*2: DVDD setting should match the signals output voltage (refer to Note 3) of customer’s system board.
*3: DCLK,HS,VS,RESET,U/D, L/R,DE,R0~R7,G0~G7,B0~B7,MODE,DITHB.
6.2 CTP Characteristics
Items
Symbol
MIN.
TYP.
MAX.
Unit
Note
Power voltage
VDD3.3V
3.0
3.3
3.5
V
Power voltage
VDD(+5)V
4.5
5
5.5
V
Forward Current
I_ VDD3.3V
50
100
150
mA
Forward Current
I_ VDD(+5V)
50
100
150
mA
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6.3 LED Backlight Circuit Characteristics
Top=25 ℃
Items
Symbol
MIN.
TYP.
MAX.
Unit
Note
Forward Voltage
Vf
8.4
9.6
10.5
V
Forward Current
If
-
180
-
mA
Cautions:
Exceeding the recommended driving current could cause substantial damage to the backlight and shorten its lifetime.
6.4 Power Sequence
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7. AC Characteristics
7.1 TFT Timing Characteristics
Item
Symbol
MIN.
TYP.
MAX.
Unit
Remark
HS setup time
Thst
5
-
-
ns
HS hold time
Thhd
5
-
-
ns
VS setup time
Tvst
5
-
-
ns
VS hold time
Tvhd
5
-
-
ns
Data setup time
Tdsu
5
-
-
ns
Data hole time
Tdhd
5
-
-
ns
DE setup time
Tesu
5
-
-
ns
DVDD Power On Slew rate
TPOR
-
-
20
ms
From 0 to 90%
DVDD
DCLK cycle time
Tcph
14
-
-
ns
DCLK pulse duty
Tcwh
40
50
60
%
Note: For the details of the timing, please see the Driver IC data sheet.
7.2 TFT Input Clock and Data Timing Diagram
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7.3 TFT Timing
Item
Symbol
MIN.
TYP.
MAX.
Unit
Remark
Clock Frequency
fclk
40.8
51.2
67.2
MHz
Horizontal Display Area
thd
-
1024
-
DCLK
HSD Period
th
1114
1344
1400
DCLK
HSD Blanking
thb+thfp
90
320
376
DCLK
Vertical Display Area
tvd
600
TH
VSD Period
tvbp
610
635
800
TH
VS Blanking
tvbp+tvfp
10
35
200
TH
7.4 TFT Data Input Format
Figure 7-4-1 Horizontal input timing diagram.
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Figure 7-4-2 Vertical input timing diagram.
7.5 CTP I2C Timing
The timing of I2C Interface
Characteristics of the SDA and SCL bus lines
7.6 CTP I2C Interface Data Structure
7.6.1 Device Address
The device addresses are 7-binary bits long and are conventionally expressed as 4 bits followed by 3 bits followed by the
letter ‘b’, 1000 001b. These addresses occupy the high seven bits of an eight-bit field on the bus.
7-bit Device
Address: 0x41
8-bit Device Read
Address:0x83
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8-bit Device Write
Address:0x82
I2C Device Address
7.6.2 CTP Data Transfer
Data is transferred over the I2C bus with 8-bit address and 8-bit data. The related protocol and timing diagrams are shown as below.
1
7
1
1
8
1
1
S
Slave Address
Wr
A
Data Byte
A
P
S
Start Condition
Sr
Repeated Start Condition
Rd
Read (bit value of 1)
Wr
Write (bit value of 0)
A
Acknowledge (this bit position may be ‘0’ for an ACK or ‘1’ for a NACK)
P
Stop Condition
Master-to-Slave
Slave-to-Master
Continue
Generic Transaction Diagram
I2C Write timing
I2C Read timing
Byte Write
S Slave Address
Wr
A Command Code A
Data Byte
A
P
Byte Read
S
Slave Address
Wr
A
Command
A
P S
Slave Address
Rd
A Data Byte
A
P
Code
Note1: CTP Driver IC:ILI2511.
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7.7 Optical Characteristics
Item
Symbol
Condition
MIN.
TYP.
MAX.
UNIT
Note.
θ L
70
85
-
Viewing angle
θ R
70
85
-
(CR ≥ 10)
degree
*2
θ T
70
85
-
θ B
70
85
-
T f
-
25
35
msec
Response Time
*3
T r
-
25
35
msec
Contrast ratio
CR
600
800
-
-
Normal
W X
0.265
0.315
0.365
-
*1
Color chromaticlty
θ=0 o
W Y
0.265
0.315
0.365
-
Luminance
L
-
400
-
cd/m 2
*4
Luminance uniformity
Y U
70
75
-
%
*4
Note:
*1. Definition of Contrast Ratio
The contrast ratio could be calculate by the following expression:
Contrast Ratio (CR) = Luminanc with all pixels white / Luminance with all pixels black
*2 Definition of Viewing Angle
*3 Definition of response time
*4 Definition of Luminance Uniformity
Luminance uniformity (Lu)=
Min. Luminance form pt1~pt9 / Max Luminance form Pt1~pt9
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8. LCD Module Design and Handling
8. 液晶显示模块设计和使用须知
Precautions
- Please ensure V0, VCOM is adjustable, to enable LCD module get - 请注意 V0, VCOM 的设定, 以确保液晶显示模块在不同
the best contrast ratio under different temperatures, view angles
的使用温度下以及在不同的视角和位置观察模块显示,
and positions.
均能达到最佳对比度,请务必将应用电路上设置为对比
度可调。
- Normally display quality should be judged under the best contrast - 请注意液晶显示模块的显示品质判定是指在正常对比度
ratio within viewable area. Unexpected display pattern may come
下以及视窗(V.A)范围内进行的,非正常对比度下液晶
out under abnormal contrast ratio.
可能会出现非预期的显示不良,应注意区分。
- Never operate the LCD module exceed the absolute maximum
- 请勿在最大额定值以外使用液晶显示模块。
ratings.
- 请勿在没有接通电源的条件下,给液晶显示模块输送信
- Never apply signal to the LCD module without power supply. (No
Hot-plugging)
号。(禁止热插拔)
- WARNING! Be aware of (if any) frame grounding of the LCD
-
警告!使用前需评估液晶显示模块的金属框架/壳体地
Module connection with the system which may cause safety issue
(如有)与整机关系和安全性(如:漏电安全性,等)
(e.g. electric shock,etc)
- Keep signal line as short as possible to reduce external noise - 请尽可能缩短信号线的连接,以避免对液晶显示模块的
interference.
信号干扰。
- IC chip (e.g. TAB or COG) is sensitive to light. Strong light might - 集成电路因 IC 芯片(如 TAB 或 COG)对紫外线极为敏感,
cause malfunction. Light sealing structure casing is recommended.
强光环境下可能会引起液晶显示模块功能失效,故应采
用不透光的外壳。
- Make sure there is enough space (with cushion) between case and
LCD panel, to prevent external force passed on to the panel;
- 请在液晶显示模块与外壳之间保留足够的空间(可使用
otherwise that may cause damage to the LCD and degrade its
衬垫),以缓冲外力对液晶显示模块的损坏或因受力不
display result.
均而产生的显示不匀等异常现象。
- Avoid showing a display pattern on screen for a long time - 避免液晶显示屏在某一画面下长时间点亮,否则有出现
(continuous ON segment).
残影的风险;请通过软件每隔一段时间改变一次画面。
- 液晶显示模块的可靠性可能因温度冲击而降低。
- LCD module reliability may be reduced by temperature shock.
- When storing and operating LCD module, avoids exposure to direct
- 请勿在阳光直射、高湿、高温或低温下储存和使用液晶
sunlight, high humidity, high or low temperature. They may damage
显示模块,这将造成液晶显示模块的损坏或失效。
or degrade the LCD module.
- Never leave LCD module in extreme condition (max./min - 请勿在极限环境(最大/最小存储/工作温度)下使用或放
storage/operate temperature) for more than 48hr.
置液晶显示模块超过 48 小时以上。
- Recommend LCD module storage conditions is 0 C~40 C
- 液晶显示模块建议存储条件为: 0 C~40 C <80%RH 。
<80%RH.
- LCD module should be stored in the room without acid, alkali and
- 请勿让液晶显示模块存储于带有 酸性, 碱性, 有害气
harmful gas.
体环境之中。
- Avoid dropping & violent shocking during transportation, and no - 在运输过程中, 请勿让液晶显示模块跌落与猛烈震动,
excessive pressure press, moisture and sunlight.
同时避免 异常挤压, 高湿度, 与阳光照射.
- LCD module can be easily damaged by static electricity. Please
- 液晶显示模块极易受静电损坏,请务必保证液晶显示模
maintain an optimum anti-static working environment to protect the
块在防静电的工作环境中使用或保存。(如: 烙铁正确
LCD module. (eg. ground the soldering irons properly)
接地,等)
- Be sure to ground the body when handling LCD module.
- 拿取液晶显示模块时需注意操作人员的接地情况。
- Only hold LCD module by its sides. Never hold LCD module by - 请手持液晶显示模块的边沿取放模块,防止热压纸或
applying force on the heat seal or TAB.
TAB 部位受力。
- When soldering, control the temperature and duration avoid
- 焊接液晶模块时,请注意控制烙铁的温度、焊接时间,
damaging the backlight guide or diffuser which might degrade the
以免烫坏导光板或偏光片,导致显示不匀等不良现象发
display result such as uneven display.
生。
- Never let LCD module contact with corrosive liquids, which might - 请勿使用洗板水等腐蚀性液体接触液晶模块,以免腐蚀
cause damage to the backlight guide or the electric circuit of LCD
导光板或模块电路。
module.
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- Only clean LCD with a soft dry cloth, Isopropyl Alcohol or Ethyl - 仅可使用柔软的干布, 异丙醇或乙醇清洁液晶屏表面,
Alcohol. Other solvents (e.g. water) may damage the LCD.
其他任何溶剂(如:水)都有可能损坏液晶模块。
- Never add force to components of LCD module. It may cause
- 请勿挤压液晶显示模块上的元器件,以避免产生潜在的
invisible damage or degrade the module's reliability.
- When mounting LCD module, please make sure it is free from
损坏或失效而影响产品可靠性。
twisting, warping and bending.
- 装配液晶显示模块时,请务必注意避免液晶显示模块的
扭曲或变形。
- Do not add excessive force on surface of LCD, which may cause - 请勿挤压液晶显示屏表面,这将导致显示颜色的异常。
the display color change abnormally.
- 液晶屏由玻璃制作而成,任何机械碰撞(如从高处跌落)
- LCD panel is made with glass. Any mechanical shock (e.g.
均有可能损坏液晶显示模块。
dropping from high place) will damage the LCD module.
- Protective film is attached on LCD screen. Be careful when peeling - 液晶屏表面带有保护膜, 揭除保护膜时需要注意可能产
off this protective film, since static electricity may be generated.
生的静电。
- Polarizer on LCD gets scratched easily. If possible, do not remove
- 因液晶显示屏表面的偏光片极易划伤,安装完成之前请
LCD protective film until the last step of installation.
- When peeling off protective film from LCD, static charge may cause
尽量不要揭下保护膜。
abnormal display pattern. The symptom is normal, and it will turn - 请缓慢揭除保护膜,在此过程中液晶显示屏上可能会产
back to normal in a short while.
生静电线,此为正常情况,可在短时间内消失
- LCD panel has sharp edges, please handle with care.
- 请注意避免被液晶显示屏的边缘割伤。
- Never attempt to disassemble or rework LCD module.
- 请不要试图拆卸或改造液晶显示模块。
- If display panel is damaged and liquid crystal substance leaks out,
- 当液晶显示屏出现破裂, 内部液晶液体可能流出; 相关
be sure not to get any in your mouth, if the substance comes into
contact with your skin or clothes promptly wash it off using soap
液体不可吞吃, 绝对不可接触嘴巴, 如接触到皮肤或衣
and water.
服, 请使用肥皂与清水彻底清洗.
9.
CTP Mounting Instructions
9. 电容触摸屏安装指导
9.1 Surface Mounting (Figure 1)
9.1 嵌入安装(附图 1)
- As the CTP assembling on the countersink area with double side - 客户面框应具有使用双面胶粘贴 CTP 的结构沉台面,其
adhesive.The countersink area should be flat and clean to ensure
粘贴面要求平整且洁净无污以保证粘贴牢靠.
the double side adhesive installation result.
- The Bezel is recommend to keep a gap ( ≥ 0.3mm each side) - 考虑到制作误差,建议面框与 CTP 盖板之间四周留有≥
around the cover lens for tolerance.
0.3mm 间隙.
- It is recommended to provide an additional support bracket with - 建议必要时在背面提供垫有胶垫附加支架(例如无安装
gasket for backside support when necessary (e.g.TFT module
结构的 TFT 模块),应仅利用适当支撑以保持模块位置.
without mounding structure). They should only provide appropriate
support and keep the module in place.
- The mounting structure should be strong enough to prevent - 安装结构应具有足够的强度,以防止外部不均匀力或扭
external uneven force or twist act onto the module
曲力作用到模块上。
Figure 1
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LMT070ENMFWA-NND-4
9.2
Pressure sensitive adhesive tape operation
9.2 压敏胶带贴合
- For maximum bond strength, the surfaces should be flat and
- 为达到最佳贴合效果,被贴合物应为平整,无翘曲, 无凸
thoroughly cleaned.
点等;并需完全清洁干净,无灰尘,无油污,无残留物等。
- 50:50 mixture of isopropyl alcohol and water is suggested.
- 建议用异丙醇和水的 50:50 混合液清洁,
或先用脱脂剂, 后用异丙醇和水的 50:50 混合液。
- Let dry before taping.
- 表面干透后才可进行贴合。
- Ideal tape application is accomplished when temperature is
- 理想作业环境温度为 21℃~38℃。
between 21° C and 38°C.Initial tape application to surfaces at
不建议在 10℃ 或以下的环境温度下作业。
temperatures below 10°C is not recommended.
- 撕去离型纸后应尽早贴合, 避免污染胶带表面。
- Alignment jig should be applied for objects alignment
- 建议使用治具定位, 一次贴正。(二次贴合可能会影响
- Pressing jig surface should be fine enough to prevent uneven
效果)初压治具需要注意平整, 避免压破模块或产生变
pressure onto the display module.
型。
- General initial tape application pressure is 15PSI (0.1N/mm²) for
- 一般初压时用不小于 15PSI (0.1N/mm²)的压力并保持
5~10sec(operating pressure can be calculated with the tape
5~10 秒(请使用胶带面积运算实际组装所需压力)。
surface area)
- The bond is allowed to dwell 72 hr (100% bond typical build).
- 初压后一般需在常温下静置(避免受力)72hr 以达到最佳
(note: 20min about 50%; 1hr about 70%; 24hr about 90%)
贴合效果(100%)。
(注: 20min 约 50%; 1hr 约 70%; 24hr 约 90%)
- Consult manufacturer ’ s directions for use and precautions when
- 详细请参阅胶带供应商的使用说明与清洁建议
using cleaning solvents.
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Warranty
This product has been manufactured to our company’s specifications as a part for use in your company’s general
electronic products. It is guaranteed to perform according to delivery specifications. For any other use apart from
general electronic equipment, we cannot take responsibility if the product is used in medical devices, nuclear power
control equipment, aerospace equipment, fire and security systems, or any other applications in which there is a direct
risk to human life and where extremely high levels of reliability are required. If the product is to be used in any of the
above applications, we will need to enter into a separate product liability agreement.
- We cannot accept responsibility for any defect, which may arise form additional manufacturing of the product
(including disassembly and reassembly), after product delivery.
- We cannot accept responsibility for any defect, which may arise after the application of strong external force to the
product.
- We cannot accept responsibility for any defect, which may arise due to the application of static electricity after the
product has passed our company’s acceptance inspection procedures.
- When the product is in CCFL models, CCFL service life and brightness will vary according to the performance of the
inverter used, leaks, etc. We cannot accept responsibility for product performance, reliability, or defect, which may
arise.
- We cannot accept responsibility for intellectual property of a third part, which may arise through the application of
our product to our assembly with exception to those issues relating directly to the structure or method of
manufacturing of our product.
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